Headline: Biomedical Bonding Secures U.S. Patent for Core Fast-Curing Resin Technology Enabling Bonevolent™

Patent protects foundational chemistry for light-curable, in situ forming fixation systems 

Biomedical Bonding AB has been granted U.S. Patent by the United States Patent and Trademark Office (USPTO). 

The patent covers a composition for fast-curing thermosetting resins based on thiol and unsaturated molecular systems, designed to form rapidly curing crosslinked networks under light activation. This enables controlled material formation and mechanical robustness suitable for applications such as fracture fixation. 

The technology allows materials to be applied and shaped directly at the site of injury, followed by rapid curing to create stable fixation structures. By enabling in situ formation, the system offers an alternative to conventional rigid implants. 

“This is a strategically important patent for Biomedical Bonding,” says Michael Malkoch, CEO and Founder. “It protects the core chemistry that enables rapid curing and mechanical integrity in our systems.” 

The patent remains in force until February 14, 2043. 

This milestone strengthens Biomedical Bonding’s intellectual property position in the United States and supports the continued development and clinical translation of its platform technologies, including customizable composite fixation systems and adhesive-based solutions.